SCOPUS 정보 검색 플랫폼

Proceedings - Electronic Components and Technology Conference

Volumn , Issue , 1996, Pages 559-564

Solder transfer technique for flip chip and electronic assembly applications

(3) Puttlitz, Karl J a Lidestri, Kathleen A a Totta, Paul A a

a IBM MICROELECTRONICS (United States)

Author keywords

[No Author keywords available]

Indexed keywords

ASSEMBLY; FLIP CHIP DEVICES; INTEGRATED CIRCUIT MANUFACTURE; LEAD ALLOYS; PASSIVATION; SOLDERED JOINTS; SOLDERING; TIN ALLOYS; TINNING; VAPOR DEPOSITION;

CHIP CARRIER PRETINNING; DECAL FABRICATION; DIRECT CHIP ATTACH; ELECTRONIC ASSEMBLY; FLIP CHIP ASSEMBLY; PRESSURE DIFFERENCE; SOLDER BUMPS; SOLDER TRANSFER TECHNIQUE; WETTABILITY TESTING;

ELECTRONICS PACKAGING;

EID: 0029718118 PISSN: 05695503 EISSN: None Source Type: None
DOI: 10.1109/ECTC.1996.517443 Document Type: Article

Times cited : (2)

References (11)

1
- 85176690757
- Non-aligned Solder Transfer Decal
- R.J. Herdzick P.A. Totta Non-aligned Solder Transfer Decal IBM TechnicalDisclosure Bulletin 19 6 2049 Nov. 1976
- (1976) IBM TechnicalDisclosure Bulletin , vol.19 , Issue.6 , pp. 2049
- Herdzick, R.J.¹ Totta, P.A.²

2
- 85176689711
- Tinning Preplated Sites on a Substrate
- R.J. Herdzick P.A. Totta Tinning Preplated Sites on a Substrate IBM Technical Disclosure Bulletin 19 8 3049 3050 Jan. 1977
- (1977) IBM Technical Disclosure Bulletin , vol.19 , Issue.8 , pp. 3049-3050
- Herdzick, R.J.¹ Totta, P.A.²

3
- 85176683041
- Decal Solder Transfer
- R.J. Herdzick P.A. Totta Decal Solder Transfer IBM Technical Disclosure Bulletin 22 3 996 Aug. 1979
- (1979) IBM Technical Disclosure Bulletin , vol.22 , Issue.3 , pp. 996
- Herdzick, R.J.¹ Totta, P.A.²

4
- 85176689600
- Method to Change Solder Composition of a Chip
- R.J. Herdzick P A Totta Method to Change Solder Composition of a Chip IBM Technical Disclosure Bulletin 22 3 995 Aug. 1979
- (1979) IBM Technical Disclosure Bulletin , vol.22 , Issue.3 , pp. 995
- Herdzick, R.J.¹ Totta, .A²

5
- 85176677781
- U.S.
- R. Meyen K,J. Puttlitz K. Schink H. Wenskus Individual Chip Joining Machine U.S. 4.160.893

6
- 70350540431
- Replacing Flip Chips on MLC Multichip Modules Using Focused Infrared (IR): The Basics
- K. J. Puttlitz K.A. Lidestri Replacing Flip Chips on MLC Multichip Modules Using Focused Infrared (IR): The Basics Proc. Intetnet Symp. On Microelect.(ISHM) 384 390 Proc. Intetnet Symp. On Microelect.(ISHM) 1992-Oct.
- (1992) , pp. 384-390
- Puttlitz, K.J.¹ Lidestri, K.A.²

7
- 85176670671
- Chip Removal and Chip Site Dressing
- R.D. McNutt K. Schink Chip Removal and Chip Site Dressing IBM Technical Disclosure Bulletin 24 2 1288 1289 July 1981
- (1981) IBM Technical Disclosure Bulletin , vol.24 , Issue.2 , pp. 1288-1289
- McNutt, R.D.¹ Schink, K.²

8
- 0008749467
- An Overview of Flip-Chip Replacement Technology on MLC Multichip Modules
- K.J. Puttlitz An Overview of Flip-Chip Replacement Technology on MLC Multichip Modules Proc. Internat. Electr. Packaging Conf. 2 909 928 Proc. Internat. Electr. Packaging Conf. 1991-Sept.
- (1991) , vol.2 , pp. 909-928
- Puttlitz, K.J.¹

9
- 0021161353
- Flip Chip Replacement within the Constraints Imposed by Multilayer Ceramic (MLC) Modules
- K.J. Puttlitz Flip Chip Replacement within the Constraints Imposed by Multilayer Ceramic (MLC) Modules J. Electr. Materials 13 1 29 46 Jan. 1984
- (1984) J. Electr. Materials , vol.13 , Issue.1 , pp. 29-46
- Puttlitz, K.J.¹

10
- 0001481987
- Geometric Optimization of Controlled Collapse Interconnections
- L.S. Goldman Geometric Optimization of Controlled Collapse Interconnections IBM J. Res. Develop. 13 3 251 264 May 1969
- (1969) IBM J. Res. Develop. , vol.13 , Issue.3 , pp. 251-264
- Goldman, L.S.¹

11
- 85176666808
- European
- A Lecuyer B Lepape B. Pottier European 0040669

* 이 정보는 Elsevier사의 SCOPUS DB에서 KISTI가 분석하여 추출한 것입니다.