New findings in the occurrence of false-healing in plastic encapsulated microcircuits using scanning acoustic microscopy

IEEE Transactions on Components and Packaging Technologies

Volumn 22, Issue 2, 1999, Pages 266-269

  Ranade, Yogendra ^a   Pecht, Michael G ^a   Moore, Thomas M ^a  

^a AGERE SYSTEMS   (United States)

Author keywords

[No Author keywords available]

Indexed keywords

ACOUSTIC IMAGING; DELAMINATION; ENCAPSULATION; FAILURE ANALYSIS; MICROSCOPIC EXAMINATION; SOLDERING;

FALSE-HEALING; PLASTIC ENCAPSULATED MICROCIRCUITS (PEM); SCANNING ACOUSTIC MICROSCOPY;

ELECTRONICS PACKAGING;

EID: 0033343063     PISSN: 15213331     EISSN: None     Source Type: Journal    
DOI: 10.1109/6144.774743     Document Type: Article

References (7)

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2. M. G. Pecht, L. T. Nguyen, and E. B. Hakim, Plastic-Encapsulated Microelectronics: Materials, Processes, Quality, Reliability, and Applications. New York: Wiley, 1995.
3. T. M. Moore, "Inspecting IC packages with C-mode acoustic microscopy," in Proc. Int. Symp. Testing Failure Anal., 1989, pp. 41-50.
4. K. Van Doorselear and K. De Zeeuw, "Relation between delamination and temperature cycling induced failures in plastic packaged devices,"IEEE Trans. Comp., Hybrids, Manufact. Technol., vol. 13, pp. 879-882, Dec. 1990.
5. R. L. Shook and T. R. Conrad, "Accelerated life performance of moisture damaged plastic surface mount devices," in Proc. Int. Rel. Physics Symp., 1993, pp. 157-168.
6. R. Gestel, K. Zeeuw, L. Gemert, and E. Bagerman, "Comparison of delamination effects between temperature cycling test and highly accelerated stress test in plastic packaged devices," in Proc. Int. Ret. Physics Symp., 1992, pp. 177-181.
7. T. M. Moore and S. J. Kelsall, "The impact of delamination on stressinduced and contamination-related failures in surface mount IC's," in Proc. Int. Rel. Physics Symp., 1992, pp. 169-176.