|
|
Volumn , Issue , 1992, Pages 169-176
|
|
The impact of delamination on stress-induced and contamination-related failure in surface mount ICs
a
a
NONE
|
|
Author keywords
[No Author keywords available]
|
|
Indexed keywords
CONTAMINATION;
INTEGRATED CIRCUITS;
MOISTURE DETERMINATION;
POLYIMIDES;
STRESSES;
THERMAL EFFECTS;
DELAMINATION;
TEMPERATURE CYCLES;
SURFACE MOUNT TECHNOLOGY;
|
|
EID: 0026836655
PISSN: 00999512
EISSN: None
Source Type: Conference Proceeding
DOI: 10.1109/relphy.1992.187642 Document Type: Conference Paper |
|
Times cited : (22)
|
|
References (13)
|
