Popcorning: A Failure Mechanism in Plastic-Encapsulated Microcircuits

IEEE Transactions on Reliability

Volumn 44, Issue 3, 1995, Pages 362-367

  Gallo, Anthony A ^a   Munamarty, Ramesh ^b  

^a Dexter Electronic Materials   (United States)

^b UNIVERSITY OF MARYLAND   (United States)

Author keywords

Failure mechanism; plastic encapsulated microcircuit; popcorning

Indexed keywords

ATMOSPHERIC HUMIDITY; BOND STRENGTH (MATERIALS); CRACKS; ELECTRONICS PACKAGING; ENCAPSULATION; FRACTURE TOUGHNESS; HIGH TEMPERATURE EFFECTS; INTERFACES (MATERIALS); PRINTED CIRCUIT MANUFACTURE; SOLDERING; STRESSES; THERMAL EXPANSION;

PLASTIC ENCAPSULATED MICROCIRCUITS; POPCORNING; REFLOW SOLDER ASSEMBLY PROCESS;

FAILURE (MECHANICAL);

EID: 0029378940     PISSN: 00189529     EISSN: 15581721     Source Type: Journal    
DOI: 10.1109/24.406565     Document Type: Article

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