Comparison of delamination effects between temperature cycling test and highly accelerated stress test in plastic packaged devices

Annual Proceedings - Reliability Physics (Symposium)

Volumn , Issue , 1992, Pages 177-181

  van Gestel, Richard ^a   de Zeeuw, Kees ^a   van Gemert, Leo ^a   Bagerman, Eef ^a  

^a NONE

Author keywords

[No Author keywords available]

Indexed keywords

ACOUSTIC DEVICES; INTEGRATED CIRCUITS; PLASTICS; RELIABILITY; STRESSES; THERMAL EFFECTS;

DELAMINATION; HIGHLY ACCELERATED STRESS TESTS; TEMPERATURE CYCLING TESTS;

ELECTRONICS PACKAGING;

EID: 0026834329     PISSN: 00999512     EISSN: None     Source Type: Conference Proceeding    
DOI: 10.1109/irps.1992.363293     Document Type: Conference Paper

References (2)