Relation Between Delamination and Temperature Cycling Induced Failures in Plastic Packaged Devices

IEEE Transactions on Components, Hybrids, and Manufacturing Technology

Volumn 13, Issue 4, 1990, Pages 879-882

  Van Doorselaer, Karel ^a   De Zeeuw, Kees ^a  

^a PHILIPS RESEARCH LABORATORIES   (Netherlands)

Author keywords

[No Author keywords available]

Indexed keywords

INTEGRATED CIRCUIT TESTING--THERMAL EFFECTS; INTEGRATED CIRCUITS--ENCAPSULATION;

CHIP TESTING; ELECTRICAL FAILURES; IC ENCAPSULATION; PLASTIC PACKAGED DEVICES; TEMPERATURE CYCLING; THERMOMECHANICAL STRESS;

ELECTRONICS PACKAGING;

EID: 0025540377     PISSN: 01486411     EISSN: None     Source Type: Journal    
DOI: 10.1109/33.62533     Document Type: Article

References (6)

1. S. Okikawa, T. Toida, M. Inatsu, and M. Tanimoto, “Stress analysis for passivation and interlevel-insulation film cracks in multilayer aluminum structures for plastic-packaged LSI,” in Proc. Int. Symp. on Testing and Failure Analysis, 1987, pp. 75–81.
2. C. G. Shirley and R. C. Blish II. “Thin-film cracking and wire ball shear in plastic DIPs due to temperature cycle and thermal shock,” in Proc. IEEE Int. Reliability Physics Symp., 1987, pp. 238–249.
3. D. R. Edwards, K. G. Heinen, J. E. Martinez, and S. Groothuis, “Shear stress evaluation of plastic packages,” in Proc. IEEE Electronic Components Conf., 1987, pp. 84–95.
4. R. E. Thomas, “Stress-induced deformation of aluminum metallization in plastic molded semiconductor devices,” in Proc. IEEE Electric Components Conf., 1985, pp. 37–45.
5. D. R. Edwards, S. K. Groothuis, and M. Murtuza, “VLSI packaging thermomechanical stresses,” Tutorial presented at the IEEE Int. Reliability Physics Symp., 1988.
6. A. van der Wijk and K. Van Doorselaer, “Non-destructive failure analysis of IC's using scanning acoustic tomography (SCAT) and high-resolution X-ray microscopy (HRXM),” in Proc. Int. Symp. Testing and Failure Analysis, 1989, pp. 69–74.