|
Volumn 38, Issue 9 A, 1999, Pages 5214-5219
|
Dielectric properties of hydrogen silsesquioxane films degraded by heat and plasma treatment
a a a a |
Author keywords
Heat treatment; Hydrogen silsesquioxane; Intermetal dielectric; Low dielectric constant; Oxygen plasma; Semiconductor; Spin on glass
|
Indexed keywords
CAPACITANCE MEASUREMENT;
FOURIER TRANSFORM INFRARED SPECTROSCOPY;
HEAT TREATMENT;
HYDROGEN INORGANIC COMPOUNDS;
PERMITTIVITY;
PLASMA APPLICATIONS;
POLARIZATION;
PYROLYSIS;
REFRACTIVE INDEX;
THERMODYNAMIC STABILITY;
VOLTAGE MEASUREMENT;
HYDROGEN SILSESQUIOXANE;
INTERMETAL DIELECTRICS;
SPIN-ON-GLASS (SOG) MATERIALS;
DIELECTRIC FILMS;
|
EID: 0033339220
PISSN: 00214922
EISSN: None
Source Type: Journal
DOI: 10.1143/jjap.38.5214 Document Type: Article |
Times cited : (28)
|
References (13)
|