0.6 μm pitch highly reliable multilevel interconnection using hydrogen silicate based inorganic SOG for sub-quarter micron CMOS technology

Digest of Technical Papers - Symposium on VLSI Technology

Volumn , Issue , 1997, Pages 79-80

  Oda, N ^a   Usami, T ^a   Kishimoto, K ^a   Matsumoto, A ^a   Mikagi, K ^a   Kikuta, K ^a   Gomi, H ^a   Sakai, I ^a  

^a NEC CORPORATION   (Japan)

Author keywords

[No Author keywords available]

Indexed keywords

CAPACITANCE MEASUREMENT; DIELECTRIC FILMS; ELECTRIC RESISTANCE MEASUREMENT; INTEGRATED CIRCUIT LAYOUT; METALLIZING; MOSFET DEVICES; PLASMA APPLICATIONS;

INTERLAYER DIELECTRIC (ILD); VIA FORMATION;

CMOS INTEGRATED CIRCUITS;

EID: 0030649235     PISSN: 07431562     EISSN: None     Source Type: Conference Proceeding    
DOI: None     Document Type: Conference Paper

References (5)