Importance of damping and resonance in thin-film integrated decoupling capacitor design

IEEE Topical Meeting on Electrical Performance of Electronic Packaging

Volumn , Issue , 1997, Pages 31-34

  Bandyopadhyay, Jaya ^a   Chahal, Premjeet ^a   Swaminathan, Madhavan ^a  

^a GEORGIA INSTITUTE OF TECHNOLOGY   (United States)

Author keywords

[No Author keywords available]

Indexed keywords

CIRCUIT RESONANCE; DAMPING; DIGITAL INTEGRATED CIRCUITS; ELECTRONICS PACKAGING; INTEGRATED CIRCUIT LAYOUT; THIN FILM DEVICES;

INTEGRATED DECOUPLING CAPACITORS;

CAPACITORS;

EID: 0031365126     PISSN: None     EISSN: None     Source Type: Conference Proceeding    
DOI: None     Document Type: Conference Paper

References (4)