Accurate power supply and ground plane pair models

IEEE Topical Meeting on Electrical Performance of Electronic Packaging

Volumn , Issue , 1998, Pages 163-166

  Wu, H H ^a   Meyer, J W ^a   Lee, K ^a   Barber, A ^a  

^a HEWLETT PACKARD COMPANY   (United States)

Author keywords

[No Author keywords available]

Indexed keywords

DIELECTRIC MATERIALS; EQUIVALENT CIRCUITS; SKIN EFFECT; TRANSMISSION LINE THEORY;

GROUND PLANE PAIR MODELS;

POWER SUPPLY CIRCUITS;

EID: 0032288102     PISSN: None     EISSN: None     Source Type: Conference Proceeding    
DOI: None     Document Type: Conference Paper

References (4)