Comparison and validation of experimental techniques to measure electronic component operating junction temperature

Proceedings of the 1998 4th International Workshop on Thermal Investigations of ICs and Microstructures

Volumn , Issue , 1998, Pages 233-238

  Lohan, J ^a   Rodgers, P ^a   Fager, C M ^a   Lehtiniemi, R ^a   Eveloy, V ^a   Tiilikka, P ^a   Rantala, J ^a  

^a NOKIA RESEARCH CENTER   (United States)

Author keywords

[No Author keywords available]

Indexed keywords

COMPUTER SIMULATION; ELECTRONICS PACKAGING; TEMPERATURE DISTRIBUTION; TESTING; THERMOANALYSIS;

THERMAL TESTS;

SEMICONDUCTOR JUNCTIONS;

EID: 0032294596     PISSN: None     EISSN: None     Source Type: Conference Proceeding    
DOI: None     Document Type: Conference Paper

References (20)