Thermal performance of a low-cost thermal enhanced plastic ball grid array package - NuBGA

Microelectronics International

Volumn 15, Issue 2, 1998, Pages 25-33

  Lau, John H ^a   Chen, K L ^a   Wu, F ^a  

^a Express Packaging Systems Inc   (United States)

Author keywords

[No Author keywords available]

Indexed keywords

EID: 13144277631     PISSN: 13565362     EISSN: None     Source Type: Journal    
DOI: 10.1108/13565369810215609     Document Type: Article

References (9)

1. ANSYS, User's Manual 5.3 (1996), Swanson Analysis Systems, Inc. Houston, PA.
2. Gillis, J.C. and Kuo, A.Y. (1996), private communication with the authors.
3. Lau, J.H. (1994), Handbook of Fine Pilch Surface Mount Technology, Van Nostrand Reinhold, New York, NY.
4. Lau, J.H. (1995), Ball Grid Array Technology, McGraw-Hill, New York, NY.
5. Lau, J.H. and Chen, K.L. (1997), "Thermal and mechanical evaluations of a cost-effective plastic ball grid array package", ASME Transactions, Journal of Electronic Packaging, Vol. 119, September, pp. 208-12.
6. Lau, J.H. and Chou, T.Y. (1998), "Electrical design of a cost-effective plastic ball grid array package - NuBGA", IEEE Transactions on CPMT.
7. Lau, J.H. and Pao, Y.H. (1997), Solder Joint Reliability of BGA, CSP, Flip Chip and Fine Pitch SMT Assemblies, McGraw-Hill, New York, NY.
8. Lau, J.H., Wong, C.P., Prince, J. and Nakayama, W. (1998), Electronic Packaging: Design, Material, Process, and Reliability, McGraw-Hill, New York, NY.
9. Sofia, J. (1995), Fundamental of Thermal Resistance Measurement, Analysis Tech, Wakefield, MA.