Electrical reliability of Cu and low-K dielectric integration

Materials Research Society Symposium - Proceedings

Volumn 511, Issue , 1998, Pages 317-327

  Wong, S Simon ^a   Loke, Alvin L S ^a   Wetzel, Jeffrey T ^a   Townsend, Paul H ^a   Vrtis, Raymond N ^a   Zussman, Melvin P ^a  

^a STANFORD UNIVERSITY   (United States)

Author keywords

[No Author keywords available]

Indexed keywords

CAPACITANCE MEASUREMENT; COPPER; DIELECTRIC MATERIALS; FLUORINE CONTAINING POLYMERS; OXIDES; PERMITTIVITY; POLYIMIDES; POLYMERS; SEMICONDUCTING SILICON; THERMAL STRESS; ULSI CIRCUITS; VOLTAGE MEASUREMENT;

BIAS TEMPERATURE STRESS; ELECTRICAL RELIABILITY; ELECTRICAL TESTING; LOW DIELECTRIC CONSTANT; POLYARYLENE ETHER;

INTEGRATED CIRCUIT MANUFACTURE;

EID: 0032293227     PISSN: 02729172     EISSN: None     Source Type: Conference Proceeding    
DOI: 10.1557/proc-511-317     Document Type: Conference Paper

References (35)