Characterization of Al-Si-Cu metal lines by means of TEM analysis and the SARF technique

Microelectronics Reliability

Volumn 37, Issue 7 SPEC. ISS., 1997, Pages 1079-1085

  Ciofi, C ^a   Franzese, M ^a   Neri, B ^a  

^a UNIVERSITY OF PISA   (Italy)

Author keywords

[No Author keywords available]

Indexed keywords

ALUMINUM; COPPER; ELECTRIC WIRING; ELECTROMIGRATION; GRAIN SIZE AND SHAPE; MICROSTRUCTURE; SEMICONDUCTING SILICON; SPECTRUM ANALYSIS; THERMAL EFFECTS; TRANSMISSION ELECTRON MICROSCOPY;

METAL LINES; QUASIBAMBOO STRUCTURE; SPECTRAL ANALYSIS OF RESISTANCE FLUCTUATIONS (SARF) TECHNIQUE;

PRINTED CIRCUIT BOARDS;

EID: 0031188355     PISSN: 00262714     EISSN: None     Source Type: Journal    
DOI: 10.1016/s0026-2714(96)00270-3     Document Type: Article

References (9)

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