Flexible integration of nonsilicon microstructures on microelectronic circuits

Proceedings of the IEEE Micro Electro Mechanical Systems (MEMS)

Volumn , Issue , 1998, Pages 263-267

  Mueller, K D ^a   Bacher, W ^a   Heckele, M ^a  

^a KARLSRUHE INSTITUTE OF TECHNOLOGY   (Germany)

Author keywords

[No Author keywords available]

Indexed keywords

BONDING; CMOS INTEGRATED CIRCUITS; ELECTRONICS PACKAGING; INTEGRATED CIRCUIT MANUFACTURE; PLASTIC FILMS; SILICON WAFERS; SUBSTRATES;

PICK AND PLACE METHODS; SELF SUPPORTING POLYMER FILMS;

MICROELECTRONIC PROCESSING;

EID: 0031650481     PISSN: None     EISSN: None     Source Type: Conference Proceeding    
DOI: None     Document Type: Conference Paper

References (5)