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Thin Solid Films

Volumn 338, Issue 1-2, 1999, Pages 24-39

A novel model of hydrogen plasma assisted chemical vapor deposition of copper

(2) Lakshmanan, Satish K a Gill, William N a

a RENSSELAER POLYTECHNIC INSTITUTE (United States)

Author keywords

Chemical vapor deposition; Copper; Electronic devices; Plasma processing and deposition

Indexed keywords

COPPER; ELECTRIC CONDUCTIVITY OF SOLIDS; HYDROGEN; MATHEMATICAL MODELS; PARTIAL DIFFERENTIAL EQUATIONS; PLASMA ENHANCED CHEMICAL VAPOR DEPOSITION; REACTION KINETICS;

BOLTZMANN EQUATION;

METALLIC FILMS;

EID: 0032760919 PISSN: 00406090 EISSN: None Source Type: Journal
DOI: 10.1016/S0040-6090(98)00958-4 Document Type: Article

Times cited : (13)

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