Micromachined thermally isolated circuits

Sensors and Actuators, A: Physical

Volumn 58, Issue 1, 1997, Pages 43-50

  Klaassen, Erno H ^a   Reay, Richard J ^a,b   Storment, Christopher ^a   Kovacs, Gregory T A ^a  

^a Stanford University   (United States)

^b LINEAR TECHNOLOGY CORP   (United States)

Author keywords

Micromachining; Thermal isolation

Indexed keywords

ETCHING; INTEGRATED CIRCUIT MANUFACTURE; SEMICONDUCTING SILICON; TEMPERATURE CONTROL; THERMAL CONDUCTIVITY;

ELECTROCHEMICAL BIASING METHOD; TETRAMETHYL AMMONIUM HYDROXIDE; THERMAL ISOLATION;

MICROMACHINING;

EID: 0030647412     PISSN: 09244247     EISSN: None     Source Type: Journal    
DOI: 10.1016/S0924-4247(97)80223-3     Document Type: Article

References (20)

1. R. Lenggenhager, H. Baltes, J. Peer and M. Forster, Thermoelectric infrared sensors by CMOS technology, IEEE Electron Device Lett., 13 (1992) 454-456.
2. R. Lenggenhager, D. Jaeggi, P. Malcovati, H. Duran, H. Baltes and E. Doering, CMSOS membrane infrared sensors and improved TMAHW etchant, Tech. Digest, IEEE Int. Electron Devices Meet., San Francisco, CA, USA, 1994, pp. 531-534.
3. M. Parameswaran, H. Baltes, L. Ristic, A. Dhaded and A. Robinson, A new approach for the fabrication of micromechanical structures, Sensors and Actuators, 19 (1989) 289-307.
4. B. Kloech, S.D. Collins, N.F. de Rooij and R.L. Smith, Study of electrochemical etch-stop for high-precision thickness control of silicon membranes, IEEE Trans. Electron Devices, 36 (1989) 663-669.
5. Available from In Vivo Metrics, PO Box 249, Healdsburg, CA 95448.
6. D. Moser, CMOS flow sensors, Ph.D. Dissertation, Physical Electronics Laboratory, ETH Zurich (1993), p. 96.
7. U. Schnakenberg, W. Benecke and P. Lange, TMAHW etchants for silicon micromachining, Proc. 6th Int. Conf. Solid-State Sensors and Actuators (Transducers '91), San Francisco, CA, 24-28 June, 1991, pp. 815-818.
8. G. Lin, B. Eyre and K. Pister, Bulk micromachining of standard CMOS using silicic acid added to TMAH for aluminum passivation, UCLA MEMS Laboratory Internal Report, TRN 95-13, June 1995.
9. The Corrosion Handbook, John Wiley, New York, 1948, p. 915.
10. 4NOH solutions, Proc. 6th Int. Conf. Solid-State Sensors and Actuators (Transducers '91), San Francisco, CA, 24-28 June, 1991, pp. 811-814,
11. E.D. Palik, O.J. Glembocki, I. Heard, P.S. Burno and L. Tenerz, Etching roughness for (100) silicon surfaces in aqueous KOH, J. Appl. Phys., 70 (1991) 3291-3300.
12. 3M Fluorad Fluorochemical Surfactants, 3M Specialty Chemicals Division, 908 North Elm St., Hinsdale, IL 60521.
13. S.A. Campbell, K. Cooper, L. Dixon, R. Earwaker, S.N. Port and DJ. Schiffrin, Inhibition of pyramid formation in the etching of Si p〈100〉 in aqueous potassium hydroxide-isopropanol, J. Micromech. Microeng., 5 (1995) 209-218.
14. W.C. Erdman and P.F. Schmidt, Anisotropic etching of silicon and germanium, US Patent No. 3 738 881 (June 12, 1973).
15. 4OH based etchants for silicon micromachining: influence of additives and stability of passivation layers, Sensors and Actuators A, 25-27 (1991) 1-7.
16. Kirk-Othmer Encyclopedia of Chemical Technology, John Wiley, New York, Vol. 17, 3rd edn., pp. 15-19.
17. Handbook of Chemistry and Physics, CRC Press, Boca Raton, 66th edn., 1986, p. D157.
18. E.H. Klaassen, R.J. Reay and G.T.A. Kovacs, Diode-based thermal RMS converter with on-chip circuitry fabricated in CMSOS, Tech. Digest, 8th Int. Conf. Solid-State Sensors and Actuators (Transducers '95/Eurosensors IX), Stockholm, Sweden, 25-29 June, 1995, pp. 154-157.
19. R.J. Reay, E.H. Klaassen and G.T.A. Kovacs, A low-power temperature-regulated bandgap voltage reference, Tech. Digest, ISSCC '95, San Francisco, CA, USA, 1995, pp. 166-167.
20. E.H. Klaassen and G.T.A. Kovacs, Integrated thermal conductivity vacuum sensor, Tech. Digest, Solid State Sensor and Actuator Workshop, Hilton Head, SC, USA, 3-6 June, 1996, pp. 249-252.