|
Volumn 2879, Issue , 1996, Pages 242-250
|
Aluminum passivation in saturated TMAHW solutions for IC-compatible microstructures and device isolation
a a a |
Author keywords
[No Author keywords available]
|
Indexed keywords
DEVICE ISOLATION;
TETRAMETHYL AMMONIUM HYDROXIDE;
ALUMINUM;
CHEMICAL VAPOR DEPOSITION;
DIELECTRIC FILMS;
ETCHING;
METALLIZING;
MICROELECTRONICS;
MICROMACHINING;
MICROSTRUCTURE;
PASSIVATION;
SEMICONDUCTING SILICON;
INTEGRATED CIRCUITS;
|
EID: 0030383723
PISSN: None
EISSN: None
Source Type: Conference Proceeding
DOI: None Document Type: Conference Paper |
Times cited : (8)
|
References (8)
|