Through-mold electrodeposition using the uniform injection cell (UIC): Workpiece and pattern scale uniformity

Electrochimica Acta

Volumn 44, Issue 23, 1999, Pages 4017-4027

  Leith, S D ^a   Schwartz, D T ^a  

^a University of Washington   (United States)

Author keywords

[No Author keywords available]

Indexed keywords

ELECTROLYTES; GEARS; LITHOGRAPHY; MASS TRANSFER; METALLIC FILMS; MICROELECTROMECHANICAL DEVICES; NICKEL ALLOYS; STATISTICAL METHODS;

MICROGEARS; THROUGH MOLD ELECTRODEPOSITION; UNIFORM INJECTION CELL (UIC) CONCEPT;

ELECTROPLATING;

EID: 0032624173     PISSN: 00134686     EISSN: None     Source Type: Journal    
DOI: 10.1016/S0013-4686(99)00162-0     Document Type: Article

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