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Volumn 19, Issue 1, 1996, Pages 64-74
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Ball grid array and flip chip technologies: their histories and prospects
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Author keywords
[No Author keywords available]
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Indexed keywords
ARRAYS;
ELECTRONIC EQUIPMENT MANUFACTURE;
ELECTRONICS PACKAGING;
FLIP CHIP DEVICES;
INTEGRATED CIRCUIT LAYOUT;
PRODUCT DESIGN;
SOLDERING ALLOYS;
SUBSTRATES;
BALL GRID ARRAY;
ELECTRONIC EQUIPMENT;
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EID: 0030100352
PISSN: 10631674
EISSN: None
Source Type: Journal
DOI: None Document Type: Article |
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Times cited : (13)
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References (58)
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