Material removal mechanisms of single-crystal silicon on nanoscale and at ultralow loads

Wear

Volumn 223, Issue 1-2, 1998, Pages 66-78

  Zhao, Xingzhong ^a   Bhushan, Bharat ^a  

^a Ohio State University   (United States)

Author keywords

Atomic force microscopy; Deformation; Material removal; Microelectromechanical systems; Scratching; Wear

Indexed keywords

ATOMIC FORCE MICROSCOPY; ELECTRON DIFFRACTION; ENERGY DISPERSIVE SPECTROSCOPY; NANOSTRUCTURED MATERIALS; PLASTIC DEFORMATION; SCANNING ELECTRON MICROSCOPY; SINGLE CRYSTALS; TRANSMISSION ELECTRON MICROSCOPY; WEAR OF MATERIALS; X RAY PHOTOELECTRON SPECTROSCOPY;

MATERIAL REMOVAL; SCRATCHING;

SILICON;

MATERIAL;

EID: 0032461278     PISSN: 00431648     EISSN: None     Source Type: Journal    
DOI: 10.1016/S0043-1648(98)00302-0     Document Type: Article

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