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H. Koike, T. Otsuki, T. Kimure, M. Fukuma, Y. Hayashi, Y. Maejima, K. Amanuma, N. Tanabe, T. Matsuki, S. Saito, T. Takeuchi, S. Kobayashim, T. Kunio, T. Hase, Y. Miyasaka, N. Shohata, and M. Takade, IEEE J. Solid-State Circuits, 31, 1625 (1996).
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K. Suu, A. Osawa, N. Tani, M. Ishihawa, K. Nakamura, T. Ozawa, K. Sameshima, A. Kamisawa, and H. Yakasu, Jpn. J. Appl. Phys., 35, 4967 (1996).
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Kobune, M.1
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R. Singh, F. Radpour, and P. Chou, J. Vac. Sci. Technol., A, 7, 1456 (1989).
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R. Singh, S. Sinha, N. J. Hsu, J. T. C. Ng, P. Chou, and R. P. S. Thakur, J. Appl. Phys., 69, 2418 (1991).
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9
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chap. 9, P. Holloway and G. E. McGuire, Editors, Noyes Publications, Park Ridge, NJ
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R. Singh, Handbook of Compound Semiconductor Technology, chap. 9, p. 442, P. Holloway and G. E. McGuire, Editors, Noyes Publications, Park Ridge, NJ (1995).
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Singh, R.1
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11744313998
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W. D. Brown, S. S. Ang, M. Loboda, B. Sammakia, R. Singh, and H. S. Rathore, Editors, PV 98-3, The Electrochemical Society Proceedings Series, Pennington, NJ
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R. Singh, in Dielectric Material Integration for Microelectronic, W. D. Brown, S. S. Ang, M. Loboda, B. Sammakia, R. Singh, and H. S. Rathore, Editors, PV 98-3, p. 1, The Electrochemical Society Proceedings Series, Pennington, NJ (1998).
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R. Singh, K. C. Cherukuri, L. Vedula, A. Rohatgi, and S. Narayanan, Appl. Phys. Lett., 1700 (1997).
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R. Sharangpani, K. C. Cherukuri, and R. Singh, J. Electrochem. Soc., 144, 669 (1997).
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Sharangpani, R.1
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