Importance of high energy photons in the curing of spin-on low dielectric constant interconnect materials

Journal of the Electrochemical Society

Volumn 144, Issue 2, 1997, Pages 669-673

  Sharangpani, R ^a,b   Cherukuri, K C ^a   Singh, R ^a,b  

^a AMRL   (United States)

^b ELECTROCHEMICAL SOCIETY   (United States)

Author keywords

[No Author keywords available]

Indexed keywords

CURING; DIELECTRIC FILMS; ELECTRIC PROPERTIES; MECHANICAL PROPERTIES; POLYIMIDES; THIN FILMS;

PHOTOEFFECT; POLYIMIDE FILM; RAPID ISOTHERMAL PROCESSING; STRUCTURAL PROPERTY;

PHOTONS;

EID: 0031079371     PISSN: 00134651     EISSN: None     Source Type: Journal    
DOI: 10.1149/1.1837465     Document Type: Article

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