Test structures for electromigration evaluation in submicron technology

IEEE International Conference on Microelectronic Test Structures

Volumn , Issue , 1996, Pages 283-287

  Morgan, Stephen ^a   De Munari, Ilaria ^a   Scorzoni, Andrea ^a   Fantini, Fausto ^a   Magri, Giovanni ^a   Zaccherini, Chiara ^a   Caprile, Candida ^a  

^a UNIVERSITY OF PARMA   (Italy)

Author keywords

[No Author keywords available]

Indexed keywords

ALUMINUM COMPOUNDS; ELECTRIC WIRING; MICROSTRUCTURE; SEMICONDUCTOR DEVICE STRUCTURES; SEMICONDUCTOR DEVICE TESTING; TITANIUM; TITANIUM NITRIDE; ULSI CIRCUITS;

BAMBOO STRUCTURES; FOUR POINT PROBE MEASUREMENT; MULTIGRAM STRUCTURES; MULTILEVEL KELVIN CONTACT;

ELECTROMIGRATION;

EID: 0029725265     PISSN: None     EISSN: None     Source Type: Conference Proceeding    
DOI: None     Document Type: Conference Paper

References (12)