One-chip wonders

IEEE Circuits and Devices Magazine

Volumn 14, Issue 5, 1998, Pages 35-42

  McShane, Erik ^a   Trivedi, Malay ^a   Xu, Ying ^a   Khandelwal, Pankaj ^a   Mulay, Amit ^a   Shenai, Krishna ^b,c  

^a UNIVERSITY OF ILLINOIS AT CHICAGO   (United States)

^b University of Illinois   (United States)

^c Systems on Silicon Research Center   (United States)

Author keywords

[No Author keywords available]

Indexed keywords

BIPOLAR TRANSISTORS; CMOS INTEGRATED CIRCUITS; COMPUTER AIDED DESIGN; ELECTRONICS PACKAGING; LINEAR INTEGRATED CIRCUITS; MICROPROCESSOR CHIPS;

PACKAGE PARASITICS; RADIOFREQUENCY ARCHITECTURES;

INTEGRATED CIRCUIT LAYOUT;

EID: 0032165605     PISSN: 87553996     EISSN: None     Source Type: Journal    
DOI: 10.1109/101.721518     Document Type: Article

References (23)

1. Shunichi Iwata, Toru Shimizu, Jiro Korematu, Katsumi Dosaka, Hideo Tsubota, and Kazunori Saitoh, "Performance evaluation of a microprocessor with on-chip DRAM and high bandwidth internal bus," in Proceedings of Custom Integrated Circuits Conference (CICC), pp. 269-272, 1996.
2. John R. Long and Miles A. Copeland, "Modeling, characterization, and design of monolithic inductors for silicon RFICs," in Proceedings of Custom Integrated Circuits Conference (CICC), pp. 185-188, 1996.
3. Chris O'Connor, "RFIC Receiver Technology for Digital Mobile Phones," Microwave Journal, vol. 40, no. 7, pp. 64-75, July 1997.
4. Asad A. Abidi, "CMOS-only RF and baseband circuits for a monolithic 900 MHz wireless transceiver," in Proceedings of Bipolar Circuits and Technology Meeting (BCTM), pp. 35-42, September 1996.
5. Franco Maloberti, "Design of high speed analog circuits for mobile communications," in Proceedings of Int'l Conference on Microelectronics, vol. 2, pp. 673-680, September 1997.
6. Patrick Thompson, "Chip-scale packaging," IEEE Spectrum, vol. 34, no. 8, pp. 36-43, August 1997.
7. Tiao Zhou and Michael Hundt, "Thermal enhancements improve PQFP heat dissipation," Power Conversion & Intelligent Motion, pp. 8-15, November 1997.
8. 2 dielectrics," IEEE Transactions on Electron Devices, vol. ED-44, pp. 104-109, January 1997.
9. 2 films under static and dynamic stress," IEEE Transactions on Electron Devices, vol. ED-44, pp. 801-808, May 1997.
10. Masafumi Miyamoto, Toshifumi Takeda, and Takeshi Furusawa, "High-speed and low-power interconnect technology for sub-quarter-micron ASICs," IEEE Transactions on Electron Devices, vol. ED-44, pp. 250-256, February 1997.
11. Tsu-Chang Lee and Jason Cong, "The new line in IC design," IEEE Spectrum, vol. 34, no. 3, pp. 52-58, March 1997.
12. Charles Piller, Randy Ross, and Bill Snyder, "Processors leap ahead," PC World, pp. 58-62, January 1998.
13. Ranjit Gharpurey and Robert G. Meyer, "Modeling and analysis of substrate coupling in integrated circuits," IEEE Journal of Solid State Circuits, vol. 31, no. 3, pp. 344-352, March 1996.
14. Kuntal Joardar, "A simple approach to modeling cross-talk in integrated circuits," IEEE Journal of Solid State Circuits, vol. 29, pp. 1212-1219, October 1994.
15. Michael L. Alles, "Thin-film SOI emerges," IEEE Spectrum, vol. 34, no. 6, pp. 37-45, June 1997.
16. Douglas A. Dallmann and Krishna Shenai, "Evaluation of self-heating in SOI CMOS ULSI," Int'l Integrated Reliability Workshop Final Report, pp. 83-89, October 1994.
17. Paul Colestock, private communication, Silvaco International, December 1997.
18. Dae-Hyung Cho, Man-Ho Seung, Nam-Ho Kim, and Hun-Sup Park, in Proceedings of IEEE Int'l Conference on Microelectronic Test Structures, vol. 10, pp. 91-94, March 1997.
19. Robert W. Dutton, Boris Troyanovsky, Zhiping Yu, Torkel Arnborg, Francis Rotella, Gordon Ma, and Junko Sato-Iwanaga, "Device simulation for RF applications," International Electron Devices Meeting, pp. 12.1.1-12.1.4, December 1997.
20. Prasanth Perugupalli, Malay Trivedi, Krishna Shenai, and S.K. Leong, "Modeling and characterization of 80V LDMOSFET for RF communications," in Proceedings of Bipolar Circuits and Technology Meeting (BCTM), pp. 92-95, September 1997.
21. TCAD Driven CAD Journal, Silvaco International, vol. 8, no. 11, pp. 1-4, November 1997.
22. Leon Alkalai, John Klein, and Mark Underwood, "The new millenium program microelectronics systems advanced technology development," New Millenium Microspacecraft Technology AIAA 34th Aerospace Sciences Meeting & Exhibit, January 1996.
23. Krishna Shenai, Erik A. McShane, and Malay Trivedi, "Electronics Technologies for Intelligent Transportation Systems," in IEEE Conference on Intelligent Transportation Systems (ITSC), November 1997.