Thin-film SOI emerges

IEEE Spectrum

Volumn 34, Issue 6, 1997, Pages 37-45

  Alles, Michael L ^a  

^a Ibis Technology Corp   (United States)

Author keywords

[No Author keywords available]

Indexed keywords

BONDING; CMOS INTEGRATED CIRCUITS; INTEGRATED CIRCUIT LAYOUT; SEMICONDUCTOR DEVICE STRUCTURES; SILICON WAFERS; THIN FILMS;

SEPARATION BY IMPLANTATION OF OXYGEN; WAFER BONDING;

SILICON ON INSULATOR TECHNOLOGY;

EID: 0031165982     PISSN: 00189235     EISSN: None     Source Type: Journal    
DOI: 10.1109/6.591663     Document Type: Article

References (0)