A family of high performance MCM-C/D packages utilizing cofired alumina multilayer ceramic and a shielded thin film redistribution structure

International Journal of Microcircuits and Electronic Packaging

Volumn 20, Issue 3, 1997, Pages 289-296

  Shutler, William ^a,b,c   Longworth, Hai ^a,c,d,e,f,g   Pennacchia, John ^a,c,h   Perfecto, Eric ^{a,c,i,j,k,l,m,n,o}   Shields, Ron ^a,c,p,q  

^a IBM MICROELECTRONICS   (United States)

^b MICHIGAN STATE UNIVERSITY   (United States)

^c IBM   (United States)

^d Howmet Corp   (United States)

^e Saigon Technology University   (Viet Nam)

^f MICHIGAN TECHNOLOGICAL UNIVERSITY   (United States)

^g MASSACHUSETTS INSTITUTE OF TECHNOLOGY   (United States)

^h POLYTECHNIC UNIVERSITY   (United States)

ⁱ UNIVERSITY OF PUERTO RICO   (Puerto Rico)

^j UNIVERSITY OF ILLINOIS AT URBANA CHAMPAIGN   (United States)

^k UNION COLLEGE   (United States)

^l IBM East Fishkill Facility   (United States)

^m IBM Microlectron Packaging Lab ^*

ⁿ IEEE

^o Society of Plastics Engineers   (United States)

^p Bldg 142   (United States)

^q Substrate Packaging Engineering

more..

Author keywords

Ceramic; High Performance; IBM; MCM C D; Multilayer; S390; Thin Film

Indexed keywords

EID: 0042643027     PISSN: 10631674     EISSN: None     Source Type: Journal    
DOI: None     Document Type: Article

References (7)

1. R. Tummala et al., "High Performance Glass Ceramic / Copper Multilayer Substrate with Thin Film Redistribution," IBM Journal of Research and Development, Vol. 36, No. 5, pg. 889, 1992.
2. G. Czornyj, K. R. Chen, et al., "Polyimide for Thin Film Redistribution on Glass-Ceramic / Copper Multilevel Substrates," 42nd Electronic Components and Technology Conference, ECTC Proceedings, San Diego, pp. 682-687, 1992.
3. K. Prasad and E. Perfecto, "Multilevel Thin Film Applications and Processes for High End System," IEEE Transactions on Components, Packaging, and Manufacturing Technology (CPMT-Part B), Vol. 17, No. 1, pp. 38-49, February 1994.
4. T. A. Wassick and L. Econoniikos, "Open Repair Technologies for MCM-D," IEEE Transactions on Components, Packaging, and Manufacturing Technology (CPMT- Part B), Vol. 18, No. 1, pp. 154-162, 1995.
5. H. P. Longworth, E. D. Perfecto, and P. V. McLaughlin, "Reliability Evaluation of Multilevel Thin Film Structures," 44th Electronic Components and Technology Conference, ECTC Proceedings, pp. 482-486, 1994.
6. M. J. Ellsworth, Jr., H. Hamel, E. D. Perfecto, and T Wassick "A High Density, High Performance MCM-C/D Package: Design, Electrical, and Process Perspective," 46th Electronic Components and Technology Conference ECTC Proceedings, pp. 821-828, 1996.
7. E. D. Perfecto, K. McEntee, K. Lidestri, H. Longworth, T. Wassick, J. Pennacchia, M. Ellsworth, and A. Merryman "MCM-D/C Application for a High Performance Module," Proceedings of International Conference on Multichip Modules (MCM), pp. 69-72, April 1996.