Optically interconnected integrated circuits to solve the CMOS interconnect bottleneck

Proceedings - Electronic Components and Technology Conference

Volumn Part F133492, Issue , 1998, Pages 992-998

  Dhoedt, B ^a   Baets, R ^a   Van Daele, P ^a   Heremans, P ^b   Van Campenhout, J ^a   Hall, J ^c   Michalzik, R ^d   Schmid, A ^e   Thienpont, H ^f   Vounckx, R ^f   Neyer, A ^g   O'Brien, D C ^h   Van Koetsem, J ⁱ  

^a GHENT UNIVERSITY   (Belgium)

^b IMEC   (Belgium)

^c GEC Marconi Materials Technology Ltd   (United Kingdom)

^d UNIVERSITY OF ULM   (Germany)

^e ETH ZURICH   (Switzerland)

^f VRIJE UNIVERSITEIT BRUSSEL   (Belgium)

^g TU DORTMUND UNIVERSITY   (Germany)

^h UNIVERSITY OF OXFORD   (United Kingdom)

ⁱ Framatome Connectors InternationalBelgium   (Belgium)

Author keywords

[No Author keywords available]

Indexed keywords

CMOS INTEGRATED CIRCUITS; DATA HANDLING; DATA TRANSFER; ELECTRIC POWER SYSTEM INTERCONNECTION; FLIP CHIP DEVICES; NETWORK COMPONENTS; OPTICAL FIBERS; PLASTIC OPTICAL FIBERS; TIMING CIRCUITS; CARRIER COMMUNICATION; COMMUNICATION CHANNELS (INFORMATION THEORY); ELECTRONICS PACKAGING; PLASTIC FILAMENTS;

BANDWIDTH LIMITATION; DATA PROCESSING SYSTEMS; ELECTRICAL INTERCONNECTIONS; EUROPEAN COMMUNITY; FLEXIBLE TRANSMISSIONS; FUTURE GENERATIONS; INTERCONNECT PERFORMANCE; TWO-DIMENSIONAL ARRAYS;

INTEGRATED CIRCUIT INTERCONNECTS; OPTICAL INTERCONNECTS;

OPTICAL CHANNELS;

EID: 0031625558     PISSN: 05695503     EISSN: None     Source Type: Conference Proceeding    
DOI: 10.1109/ECTC.1998.678831     Document Type: Conference Paper

References (6)

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2. R. King, R. Michalzik, C. Jung, M. Grabherr, F. Eberhard, Jaeger, K. J. Ebeling, "Oxide confined 2D VCSEL arrays for high-density inter/intra-chip interconnects", in "Vertical Cavity Surface Emitting Lasers II", R. A. Morgan and K. D. Choquette (Eds. ), Proc. SPIE 3286, 1998.
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6. M. Johnck, A. Neyer, "2D optical array interconnects using plastic optical fibres", Electron. Lett., 1997, 33, pp. 888-889.