Plastic VCSEL array packaging and high density polymer waveguides for board and backplane optical interconnect

Proceedings - Electronic Components and Technology Conference

Volumn Part F133492, Issue , 1998, Pages 999-1005

  Liu, Y S ^a   Wojnarowski, R J ^a   Hennessy, W A ^a   Piacente, P A ^a   Rowlette, J ^b   Kadar Kallen, M ^b   Stack, J ^b   Liu, Yue ^c   Peczalski, A ^c   Nahata, A ^d   Yardley, J ^d  

^a GE GLOBAL RESEARCH   (United States)

^b Technology Group AMP   (United States)

^c HONEYWELL TECHNOLOGY CENTER   (United States)

^d AlliedSignal Research and Technology Center   (United States)

Author keywords

[No Author keywords available]

Indexed keywords

APPLICATION PROGRAMS; COMPUTER AIDED DESIGN; DISTRIBUTED COMPUTER SYSTEMS; GUIDED ELECTROMAGNETIC WAVE PROPAGATION; NETWORK COMPONENTS; OPTICAL INTERCONNECTS; PACKAGING; WAVEGUIDE COMPONENTS; ELECTRONICS PACKAGING; OPTICAL WAVEGUIDES; POLYMERS; SEMICONDUCTOR LASERS;

INTERCONNECT TECHNOLOGY; MULTIMODE GUIDED-WAVE; OPTICAL INTERCONNECT; OPTICAL POLYMER WAVEGUIDES; OPTOELECTRONIC PACKAGING; PACKAGING TECHNOLOGIES; POLYMER OPTICAL INTERCONNECT; UNIVERSITY OF CALIFORNIA;

POLYMERS; OPTICAL INTERCONNECTS;

POLYMER WAVEGUIDES; VERTICAL CAVITY EMITTING LASER (VCSEL) LASERS;

EID: 0031626181     PISSN: 05695503     EISSN: None     Source Type: Conference Proceeding    
DOI: 10.1109/ECTC.1998.678832     Document Type: Conference Paper

References (13)

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