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Volumn , Issue , 1997, Pages 1227-1234

3D Packaging solutions for a silicon micropump

Author keywords

[No Author keywords available]

Indexed keywords

BUCKLING; FINITE ELEMENT METHOD; MICROELECTRONICS; MICROMACHINING; MULTICHIP MODULES; NUMERICAL METHODS; RESIDUAL STRESSES; SEMICONDUCTING SILICON; STRESS ANALYSIS; SUBSTRATES;

EID: 0030649129     PISSN: 05695503     EISSN: None     Source Type: Conference Proceeding    
DOI: None     Document Type: Conference Paper
Times cited : (4)

References (15)
  • Reference 정보가 존재하지 않습니다.

* 이 정보는 Elsevier사의 SCOPUS DB에서 KISTI가 분석하여 추출한 것입니다.