3D Packaging solutions for a silicon micropump

Proceedings - Electronic Components and Technology Conference

Volumn , Issue , 1997, Pages 1227-1234

  Kelly, G ^a   Alderman, J ^a   Lyden, C ^a   Barrett, J ^a   Morrissey, A ^a   Val, A ^a   Sbiaa, Z ^a   Camon, H ^a  

^a UNIVERSITY COLLEGE CORK   (Ireland)

Author keywords

[No Author keywords available]

Indexed keywords

BUCKLING; FINITE ELEMENT METHOD; MICROELECTRONICS; MICROMACHINING; MULTICHIP MODULES; NUMERICAL METHODS; RESIDUAL STRESSES; SEMICONDUCTING SILICON; STRESS ANALYSIS; SUBSTRATES;

SILICON MEMBRANE MICROPUMP;

ELECTRONICS PACKAGING;

EID: 0030649129     PISSN: 05695503     EISSN: None     Source Type: Conference Proceeding    
DOI: None     Document Type: Conference Paper

References (15)