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Volumn , Issue , 1997, Pages 1227-1234
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3D Packaging solutions for a silicon micropump
a
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Author keywords
[No Author keywords available]
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Indexed keywords
BUCKLING;
FINITE ELEMENT METHOD;
MICROELECTRONICS;
MICROMACHINING;
MULTICHIP MODULES;
NUMERICAL METHODS;
RESIDUAL STRESSES;
SEMICONDUCTING SILICON;
STRESS ANALYSIS;
SUBSTRATES;
SILICON MEMBRANE MICROPUMP;
ELECTRONICS PACKAGING;
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EID: 0030649129
PISSN: 05695503
EISSN: None
Source Type: Conference Proceeding
DOI: None Document Type: Conference Paper |
Times cited : (4)
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References (15)
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