Resolving displacement field of solder ball in flip-chip package by both phase shifting moire interferometry and FEM modeling

Proceedings - Electronic Components and Technology Conference

Volumn Part F133492, Issue , 1998, Pages 1345-1353

  Liu, Sheng ^a   Wang, Jianjun ^a   Zou, Daqing ^a   He, Xiaoynan ^a   Qian, Zhengfang ^a   Guo, Y ^b  

^a Wayne State University   (United States)

^b MOTOROLA INC   (United States)

Author keywords

[No Author keywords available]

Indexed keywords

DEFORMATION; ELECTRONICS PACKAGING; FINITE ELEMENT METHOD; IMAGE PROCESSING; INTERFEROMETRY; MOIRE FRINGES; NANOTECHNOLOGY; NETWORK COMPONENTS; SOLDERING; THERMOELECTRICITY; VISCOELASTICITY; FLIP CHIP DEVICES; MATHEMATICAL MODELS; VISCOPLASTICITY;

IMAGE-PROCESSING SOFTWARE; NANO-SCALE DEFORMATION; NANOSCALE DISPLACEMENT; NON-LINEAR FINITE ELEMENTS; PHASE SHIFTING MOIRE INTERFEROMETRY; PHASE-SHIFTING TECHNIQUE; VISCO-ELASTIC MATERIAL; VISCOPLASTIC MATERIALS;

FLIP CHIP DEVICES; ELECTRONICS PACKAGING;

DISPLACEMENT FIELDS; PHASE SHIFTING MOIRE INTERFEROMETRY;

EID: 0031633061     PISSN: 05695503     EISSN: None     Source Type: Conference Proceeding    
DOI: 10.1109/ECTC.1998.678919     Document Type: Conference Paper

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