Thermal behavior study of power plastic package by high temperature moire interferometry and FEA modelling

American Society of Mechanical Engineers, EEP

Volumn 16, Issue , 1996, Pages 141-148

  Zhu, Jiansen ^a   Zou, Daqing ^a   Liu, Sheng ^a   Benson, Jim ^a  

^a WAYNE STATE UNIVERSITY   (United States)

Author keywords

[No Author keywords available]

Indexed keywords

DELAMINATION; DIFFRACTION GRATINGS; ELECTRONICS PACKAGING; FINITE ELEMENT METHOD; HIGH TEMPERATURE TESTING; INTERFEROMETRY; MATHEMATICAL MODELS; PLASTIC DEFORMATION; POWER ELECTRONICS; THERMAL EFFECTS;

POWER PLASTIC PACKAGES;

SURFACE MOUNT TECHNOLOGY;

EID: 0030381711     PISSN: None     EISSN: None     Source Type: Conference Proceeding    
DOI: None     Document Type: Conference Review

References (5)