The effect of underfill delamination on the reliability of flip chip modules

American Society of Mechanical Engineers, Applied Mechanics Division, AMD

Volumn 222, Issue , 1997, Pages 73-83

  Rzepka, Sven ^a   Korhonen, Matt A ^b   Meusel, Ekkehard ^a   Li, Che Yu ^b  

^a DRESDEN UNIVERSITY OF TECHNOLOGY   (Germany)

^b Cornell University ^*  (United States)

Author keywords

[No Author keywords available]

Indexed keywords

CRACK PROPAGATION; DELAMINATION; EPOXY RESINS; ESTIMATION; FINITE ELEMENT METHOD; FLIP CHIP DEVICES; INTERFACES (MATERIALS); RELIABILITY; SOLDERED JOINTS; STRESS ANALYSIS; STRESSES; SUBSTRATES;

DAMAGE INTEGRAL METHOD; UNDERFILL DELAMINATION;

FRACTURE MECHANICS;

EID: 0031342954     PISSN: 01608835     EISSN: None     Source Type: Conference Proceeding    
DOI: None     Document Type: Article

References (14)

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