Comparison of acoustic microscope, x-ray radiography, dye penetrant and destructive physical analysis data for die attachment analysis

American Society of Mechanical Engineers, Applied Mechanics Division, AMD

Volumn 222, Issue , 1997, Pages 175-180

  Gilmour, Duane A ^a   Reilly, James F ^a   Calabrese, Donald W ^a,b  

^a AIR FORCE RESEARCH LABORATORY   (United States)

^b IITRI ^*  (United States)

Author keywords

[No Author keywords available]

Indexed keywords

ACOUSTIC MICROSCOPES; ADHESION; DELAMINATION; FAILURE ANALYSIS; HEAT LOSSES; INTERFACES (MATERIALS); MULTICHIP MODULES; OPTICAL MICROSCOPY; SEMICONDUCTING SILICON; X RAY RADIOGRAPHY;

ACOUSTIC MICROSCOPY; DYE PENETRANT TEST; METALLURGICAL CROSS SECTION; SILICON DIE;

FRACTURE MECHANICS;

EID: 0031387930     PISSN: 01608835     EISSN: None     Source Type: Conference Proceeding    
DOI: None     Document Type: Review

References (2)

1. Sonoscan, Inc., "Acoustic Microscopy Advanced User's Workshop", Jan. 1994.
2. A. Selfridge, "Approximate Material Properties in Isotropic Materials", IEEE Trans, on Sonics and Ultrasonics, vol. SU-32, no. 3, pp. 381-394, May 1985.