FE-simulation for polymeric packaging materials

IEEE International Symposium on Polymeric Electronics Packaging, PEP

Volumn , Issue , 1997, Pages 140-148

  Dudek, Rainer ^a   Scherzer, Matthias ^a   Schubert, Andreas ^a   Michel, Bernd ^a  

^a FRAUNHOFER IZM   (Germany)

Author keywords

[No Author keywords available]

Indexed keywords

COMPUTER SIMULATION; ENCAPSULATION; EPOXY RESINS; FINITE ELEMENT METHOD; INTEGRATED CIRCUIT MANUFACTURE; INTEGRATED CIRCUIT TESTING; INTERFACES (MATERIALS); SEMICONDUCTING SILICON;

POLYMERIC PACKAGING MATERIALS;

ELECTRONICS PACKAGING;

EID: 0031378977     PISSN: 14029855     EISSN: None     Source Type: Conference Proceeding    
DOI: None     Document Type: Conference Paper

References (10)