Application of a surrogate layer for lower bending stress in a tri-material body

Proceedings - Electronic Components and Technology Conference

Volumn , Issue , 1996, Pages 435-439

  Suhir, Ephraim ^a   Weld, John D ^a  

^a LUCENT TECHNOLOGIES   (United States)

Author keywords

[No Author keywords available]

Indexed keywords

CERAMIC MATERIALS; EPOXY RESINS; INTEGRATED CIRCUIT MANUFACTURE; MECHANICAL PROPERTIES; MOLDING; MULTILAYERS; THERMAL EFFECTS; THERMAL EXPANSION; THERMAL STRESS;

BALL GRID ARRAY PACKAGES; BENDING STRESS; EPOXY MOLDING COMPOUNDS; MULTILAYER STRUCTURES; SURROGATE LAYER; TRIMATERIAL BODY;

ELECTRONICS PACKAGING;

EID: 0029696520     PISSN: 05695503     EISSN: None     Source Type: Conference Proceeding    
DOI: None     Document Type: Article

References (2)