Comparison of finite element stress analysis results with peel strength at the copper-polyimide interface

Journal of Adhesion Science and Technology

Volumn 7, Issue 12 pt 2, 1993, Pages 1293-1307

  Holloway, K ^a   Buchwalter, L P ^a   Lacombe, R H ^a  

^a IBM   (United States)

Author keywords

[No Author keywords available]

Indexed keywords

FINITE ELEMENT METHOD; TRANSMISSION ELECTRON MICROSCOPY; X RAY ANALYSIS;

EXPLORATORY STRESS ANALYSIS; PEEL TEST ANALYSIS; WEAK ADHESION RESULTS; X RAY PHOTOELECTRON SPECTROSCOPY;

STRESSES;

EID: 0027718888     PISSN: 01694243     EISSN: None     Source Type: Journal    
DOI: None     Document Type: Article

References (10)