Three-Dimensional masterslice mmic on si substrate

IEEE Transactions on Microwave Theory and Techniques

Volumn 45, Issue 12 PART 2, 1997, Pages 2524-2530

  Toyoda, Ichihiko ^a  

^a NTT CORPORATION   (Japan)

Author keywords

Bipolar integrated circuits; Finite element methods; Masterslice; Mmic's; Silicon devices; Three dimensional structures

Indexed keywords

BIPOLAR INTEGRATED CIRCUITS; BIPOLAR TRANSISTORS; COST ACCOUNTING; FINITE ELEMENT METHOD; MICROSTRIP LINES; MICROWAVE AMPLIFIERS; MIXER CIRCUITS; SEMICONDUCTING SILICON; SEMICONDUCTOR DEVICE STRUCTURES; SUBSTRATES; WAVEGUIDES;

THIN FILM MICROSTRIP LINES (TFMS); THREE DIMENSIONAL MASTERSLICE;

MONOLITHIC MICROWAVE INTEGRATED CIRCUITS;

EID: 0031338938     PISSN: 00189480     EISSN: None     Source Type: Journal    
DOI: 10.1109/22.643869     Document Type: Article

References (17)

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