Three-Dimensional Passive Circuit Technology For Ultra-Compact MMIC' s

IEEE Transactions on Microwave Theory and Techniques

Volumn 43, Issue 12, 1995, Pages 2845-2850

  Hirano, Makoto ^a   Nishikawa, Kenjiro ^a   Toyoda, Ichihiko ^a   Aoyama, Shinji ^a   Sugitani, Suehiro ^a   Yamasaki, Kimiyoshi ^a  

^a NTT CORPORATION   (Japan)

Author keywords

[No Author keywords available]

Indexed keywords

COUPLED CIRCUITS; ELECTRIC CURRENTS; ELECTRIC INSULATORS; ELECTROPLATING; FABRICATION; GOLD; MICROSTRIP LINES; PASSIVE NETWORKS; POLYIMIDES; TECHNOLOGY; THREE DIMENSIONAL; TUNGSTEN COMPOUNDS;

ION MILLING; METAL INSULATOR STRUCTURE; MICROWAVE; PASSIVE CIRCUIT TECHNOLOGY;

MONOLITHIC MICROWAVE INTEGRATED CIRCUITS;

EID: 0029509348     PISSN: 00189480     EISSN: 15579670     Source Type: Journal    
DOI: 10.1109/22.475644     Document Type: Article

References (8)

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2. T. Tokumitsu, T. Hiraoka, H. Nakamoto, and T. Takenaka, “Multilayer MMIC using a 3 μm x 3-layer dielectric film structure,” in 1990 IEEE MTT-S Dig., S-5, June 1990, pp. 831–834.
3. I. Toyoda, T. Hirota, T. Hiraoka, and T. Tokumitsu, “Multilayer MMIC branch-line coupler and broad-side coupler,” in IEEE 1992, MMWMC Dig., June 1992, pp. 79–82.
4. M. Hirano, Y. Imai, and K. Asai, “1/4 Miniaturized passive elements for GaAs MMIC's,” in IEEE GaAs IC Symp., 1991, pp. 34–40.
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6. M. Hirano, A. Aoyama, and K. Yamasaki, “Submicrometer gold interconnect wiring by sidewall electroplating technology,” Jpn. J. Appl. Phys., vol. 33, pp. L553–L555, Apr. 1994.
7. I. Toyoda, M. Hirano, and T. Tokumitsu, “An ultra-wide band miniature Balun for 3-dimensional MMIC's,” APMC, vol. 22, no. 2, pp. 511–514, Dec. 1994.
8. S. Yamaguchi, Y. Imai, T. Shibata, T. Otsuji, M. Hirano, and E. Sano, “An inverted microstrip line IC structure for ultra-high-speed applications,” in IEEE MTT-S Dig., May 1995, pp. 1643–1646.