Three-dimensional MMIC technology for multifunction integration and its possible application to masterslice MMIC

Digest of Papers - IEEE Microwave and Millimeter-Wave Monolithic Circuits Symposium

Volumn , Issue , 1996, Pages 85-88

  Tokumitsu, Tsuneo ^a   Nishikawa, Kenjiro ^a   Kamogawa, Kenji ^a   Toyoda, Ichihiko ^a   Aikawa, Masayoshi ^a  

^a NTT CORPORATION   (Japan)

Author keywords

[No Author keywords available]

Indexed keywords

AMPLIFIERS (ELECTRONIC); INTEGRATED CIRCUIT LAYOUT; INTEGRATED CIRCUIT MANUFACTURE; MESFET DEVICES; POLYIMIDES; SEMICONDUCTOR DEVICE STRUCTURES; TECHNOLOGY; THIN FILMS;

AMPLIFIER MINIATURIZATION; GROUND METALS; INTEGRATION LEVEL; MATCHING CIRCUITS; MULTIFUNCTION INTEGRATION; THIN POLYIMIDE FILMS;

MONOLITHIC MICROWAVE INTEGRATED CIRCUITS;

EID: 0029702979     PISSN: 00748587     EISSN: None     Source Type: Conference Proceeding    
DOI: None     Document Type: Conference Paper

References (8)