Thermal mapping of interconnects subjected to brief electrical stresses

IEEE Electron Device Letters

Volumn 18, Issue 11, 1997, Pages 512-514

  Ju, Y S ^a   Goodson, K E ^a  

^a Stanford University   (United States)

Author keywords

[No Author keywords available]

Indexed keywords

CALIBRATION; ELECTRIC DISCHARGES; ELECTROSTATICS; LASER APPLICATIONS; TEMPERATURE DISTRIBUTION; THERMOMETERS;

ELECTRICAL PULSES; THERMAL MAPPING;

INTEGRATED CIRCUIT MANUFACTURE;

EID: 0031268399     PISSN: 07413106     EISSN: None     Source Type: Journal    
DOI: 10.1109/55.641429     Document Type: Article

References (11)

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