Short-timescale thermal mapping of interconnects

Annual Proceedings - Reliability Physics (Symposium)

Volumn , Issue , 1997, Pages 320-324

  Ju, Yongho Sungtaek ^a   Goodson, Kenneth Eugene ^a  

^a STANFORD UNIVERSITY   (United States)

Author keywords

[No Author keywords available]

Indexed keywords

ALUMINUM; CURRENT DENSITY; ELECTRIC DISCHARGES; ELECTRIC WIRING; ELECTROSTATICS; INTEGRATED CIRCUIT LAYOUT; METAL MELTING; PASSIVATION; POLYMERS; TEMPERATURE DISTRIBUTION;

ELECTROSTATIC DISCHARGES (ESD); SCANNING LASER REFLECTANCE THERMOMETRY TECHNIQUE; SHORT TIMESCALE THERMAL MAPPING;

VLSI CIRCUITS;

EID: 0030646608     PISSN: 00999512     EISSN: None     Source Type: Conference Proceeding    
DOI: None     Document Type: Conference Paper

References (14)