Vapor deposition of low-dielectric-constant polymeric thin films

MRS Bulletin

Volumn 22, Issue 10, 1997, Pages 28-32

  Lu, T M ^a   Moore, J A ^a  

^a NONE

Author keywords

[No Author keywords available]

Indexed keywords

ADHESION; DIFFUSION; INTEGRATED CIRCUIT MANUFACTURE; MECHANICAL PROPERTIES; ORGANIC POLYMERS; PERMITTIVITY; PLASTIC FILMS; SYNTHESIS (CHEMICAL); THERMODYNAMIC STABILITY; VAPOR DEPOSITION;

LOW DIELECTRIC CONSTANT POLYMERIC THIN FILMS; VAPOR DEPOSITED POLYMERS;

DIELECTRIC FILMS;

EID: 0031256425     PISSN: 08837694     EISSN: None     Source Type: Journal    
DOI: 10.1557/s0883769400034163     Document Type: Article

References (30)

1. J.A. Moore, C-I. Lang, T-M. Lu, and G-R. Yang, Polym. Mater. Sci. Eng. 72 (1995) p. 437.
2. M.J. Szwarc, Discuss. Faraday Soc. 2 (1957) p. 46; W.F. Gorham, U.S. Patent No. 3,342,754 (September 1967).
3. M.J. Szwarc, Discuss. Faraday Soc. 2 (1957) p. 46; W.F. Gorham, U.S. Patent No. 3,342,754 (September 1967).
4. R.K. Wu, G-R. Yang, J.F. McDonald, and T-M. Lu, J. Electron. Mater. 24 (1995) p. 53; G-R. Yang, D. Mathur, X-M. Wu, S. Dabral, J.F. McDonald, and T-M. Lu, ibid. 25 (1996) p. 1778; L. You, G-R. Yang, D.B. Knorr, J.F. McDonald, and T-M. Lu, Appl. Phys. Lett. 64 (1994) p. 2812.
5. R.K. Wu, G-R. Yang, J.F. McDonald, and T-M. Lu, J. Electron. Mater. 24 (1995) p. 53; G-R. Yang, D. Mathur, X-M. Wu, S. Dabral, J.F. McDonald, and T-M. Lu, ibid. 25 (1996) p. 1778; L. You, G-R. Yang, D.B. Knorr, J.F. McDonald, and T-M. Lu, Appl. Phys. Lett. 64 (1994) p. 2812.
6. R.K. Wu, G-R. Yang, J.F. McDonald, and T-M. Lu, J. Electron. Mater. 24 (1995) p. 53; G-R. Yang, D. Mathur, X-M. Wu, S. Dabral, J.F. McDonald, and T-M. Lu, ibid. 25 (1996) p. 1778; L. You, G-R. Yang, D.B. Knorr, J.F. McDonald, and T-M. Lu, Appl. Phys. Lett. 64 (1994) p. 2812.
7. X. Zhang, S. Dabral, B.J. Howard, J. Bica, C. Chiang, V. Ochoa, P. Ficalora, C. Steinbruchel, H. Bakhru, T-M. Lu, and J.F. McDonald, "Submicrometer Metallization," SPIE, vol. 1805 (1992) p. 30.
8. G-R. Yang, S. Ganguli, J. Karcz, W.N. Gill, and T-M. Lu (unpublished).
9. G-R. Yang, B. Wang, T-M. Lu, and J. McDonald, Proc. 2nd Int. DUMIC Conf. (1996) p. 214.
10. B. Wang, J.F. McDonald, G-R. Yang, T-M. Lu, S. Ganguli, W. Gill, S.L. Hu, G. Lai, E.P. Marsh, and K. Orr, Proc. 3rd Int. DUMIC (1997) p. 125.
11. K.J. Taylor, M. Eissa, J. Gaynor, and H. Nguyen, in Low-Dielectric Constant Materials III, edited by C. Case, P. Kohl, T. Kikkawa, and W.W. Lee (Mater. Res. Soc. Symp. Proc. 476, Pittsburgh, 1997).
12. W.F. Gorham, U.S. Patent No. 3,342,754 (September 1967); S.W. Chow, L.A. Pilato, and W.L. Wheelwright, J. Org. Chem. 35 (September, 1967) p. 20.
13. W.F. Gorham, U.S. Patent No. 3,342,754 (September 1967); S.W. Chow, L.A. Pilato, and W.L. Wheelwright, J. Org. Chem. 35 (September, 1967) p. 20.
14. B.L. Joesten, J. Appl. Polym. Sci. 18 (1974) p. 439.
15. A.S. Harrus, M.A. Plano, D. Kumar, and J. Kelly, in Low-Dielectric Constant Materials II, edited by K. Uram, H. Treichel, A.C. Jones, and A. Lgendijk (Mater. Res. Soc. Symp. Proc. 443, Pittsburgh, 1997).
16. W.R. Hertler, J. Org. Chem. 28 (1963) p. 2877.
17. L. You, G-R. Yang, C-I. Lang, J.A. Moore, P. Wu, J.F. McDonald,andT-M. Lu, in Vac. Sci. Technol. A 11 (1993) p. 3047.
18. L. You, G-R. Yang, T-M. Lu, J.A. Moore, and J.F. McDonald, U.S. Patent 5,268,202 (December 1993); L. You, G-R. Yang, C-I. Lang, P. Wu, J.A. Moore, J.F. McDonald, and T-M. Lu, in Chemical Perspectives of Microelectronic Materials III, edited by C.R. Abernathy, C.W. Bates, D.A. Bohling, and W.S. Hobson (Mater. Res. Soc. Proc. 282, Pittsburgh, 1993).
19. L. You, G-R. Yang, T-M. Lu, J.A. Moore, and J.F. McDonald, U.S. Patent 5,268,202 (December 1993); L. You, G-R. Yang, C-I. Lang, P. Wu, J.A. Moore, J.F. McDonald, and T-M. Lu, in Chemical Perspectives of Microelectronic Materials III, edited by C.R. Abernathy, C.W. Bates, D.A. Bohling, and W.S. Hobson (Mater. Res. Soc. Proc. 282, Pittsburgh, 1993).
20. W.R. Dolbier, Jr., M.A. Asghar, and H-Q. Pan, U.S. Patent 5,210,341 (1993).
21. J.A. John and J.M. Tour, J. Am. Chem. Soc. 116 (1994) p. 5011.
22. C-I. Lang, G-R. Yang, J.A. Moore, and T-M. Lu, in Low-Dielectric Constant Materials - Synthesis and Applications in Microelectron-ics, edited by T-M. Lu, S.P. Murarka, T.S. Kuan, and C-H. Ting (Mater. Res. Soc. Symp. Proc. 381, Pittsburgh, 1995) p. 45.
23. W. deWilde and G. deMey, Vacuum 24 (1973) p. 307.
24. P.R. Resnick, Polym. Prepr. 31 (1990) p. 312.
25. T. Nason, J.A. Moore, and T-M. Lu, Appl. Phys. Lett. 60 (1992) p. 1866.
26. G.B. Blanchet, ibid. 62 (1993) p. 478.
27. R. Singh and R. Sharangpani, Proc. 2nd Int. DUMIC Conf. (1996) p. 78.
28. S. Dabral, X. Zhang, B. Wang, G-R. Yang, T-M. Lu, and J.F. McDonald, in Low-Dielectric Constant Materials-Synthesis and Applications in Microelectronics, edited by T-M. Lu, S.P. Murarka, T.S. Kuan, and C.H. Ting (Mat. Res. Soc. Symp. Proc. 381, Pittsburgh, 1995) p. 205.
29. S-P. Jeng, K. Taylor, M-C. Chang, L. Ting, C. Lee, P. McAnally, T. Seha, K. Numata, T. Tanaka, and R. Havemann, ibid. (1995) p. 197.
30. R.J. Gutmann, T.P. Chow, D.J. Duquette, T-M. Lu, J.F. McDonald, and S.P. Murarka, ibid. p. 177.