Parylene AF-4: A low εR material candidate for ULSI multilevel interconnect applications

Materials Research Society Symposium - Proceedings

Volumn 443, Issue , 1997, Pages 21-33

  Harrus, A S ^a   Plano, M A ^a   Kumar, D ^a   Kelly, J ^a  

^a NOVELLUS SYSTEMS INC   (United States)

Author keywords

[No Author keywords available]

Indexed keywords

ADHESION; CHEMICAL VAPOR DEPOSITION; ETCHING; FLUORINE CONTAINING POLYMERS; PERMITTIVITY; POLYMERIZATION; SEMICONDUCTOR DEVICE MANUFACTURE; SUBSTRATES; THERMODYNAMIC STABILITY; ULSI CIRCUITS;

INTERMETAL DIELECTRICS; PARYLENE;

DIELECTRIC MATERIALS;

EID: 0030709021     PISSN: 02729172     EISSN: None     Source Type: Conference Proceeding    
DOI: None     Document Type: Conference Paper

References (19)