Temperature and thermal conductivity modes of scanning probe microscopy for electromigration studies

Microelectronics Reliability

Volumn 37, Issue 10-11, 1997, Pages 1495-1498

  Buck, A ^a   Jones, B K ^a   Pollock, H M ^a  

^a LANCASTER UNIVERSITY   (United Kingdom)

Author keywords

[No Author keywords available]

Indexed keywords

MICROSCOPIC EXAMINATION; PASSIVATION; TEMPERATURE; THERMAL CONDUCTIVITY; THERMOCOUPLES; THERMOMETERS;

PASSIVE TEMPERATURE SENSING PROBE; SCANNING PROBE MICROSCOPY;

ELECTROMIGRATION;

EID: 0031251483     PISSN: 00262714     EISSN: None     Source Type: Journal    
DOI: 10.1016/S0026-2714(97)00094-2     Document Type: Article

References (6)

1. A Hammiche, H M Pollock, M Song and D J Hourston, Sub-surface imaging by scanning thermal microscopy, Measurement Science and Technology 7, 142-150, (1996).
2. A Hammiche, H M Pollock, D J Hourston, M Reading and M Song, Scanning thermal microscopy: sub-surface imaging, thermal mapping of polymer blends, localised calorimetry, J Vac Sci Technol B: Microelectronics and Nanostructures 14 1486-1491, (1996).
3. A Hammiche, M Reading, H M Pollock, M Song and D J Hourston, Localised thermal analysis using a miniaturised resistive probe, Rev. Sci. Instrum. 67, 4268-4274, (1996).
4. B.K. Jones and Y.Z. Xu, Measurement of the electrical properties of electromigration specimens, Rev. Sci. Instrum. 66 4676-80, (1995).
5. B.K. Jones, Microscopic Measurements of Electromigration Damage using Electrical Measurements, Mat. Res. Soc. Symp. Proc. 391 489-500 (1995).
6. B.K. Jones, Y.Z. Xu and P. Zobbi, The evolution of the microscopic damage in electromigration studied by multiple electrical measurements, Microelectron. Reliab. 36 1051-62, (1996).