The evolution of the microscopic damage in electromigration studied by multiple electrical measurements

Microelectronics Reliability

Volumn 36, Issue 7-8 SPEC. ISS., 1996, Pages 1051-1062

  Jones, B K ^a   Xu, Y Z ^a   Zobbi, P ^b  

^a LANCASTER UNIVERSITY   (United Kingdom)

^b NONE

Author keywords

[No Author keywords available]

Indexed keywords

ELECTRIC RESISTANCE MEASUREMENT; FAILURE ANALYSIS; INTEGRATED CIRCUIT MANUFACTURE; MICROSCOPIC EXAMINATION; THERMAL EFFECTS;

JOULE HEATING EFFECTS; MICROSCOPIC DEGRADATION;

ELECTROMIGRATION;

EID: 0030193037     PISSN: 00262714     EISSN: None     Source Type: Journal    
DOI: 10.1016/0026-2714(96)00029-7     Document Type: Article

References (8)

1. B.K. Jones and Y.Z. Xu, "Characterisation of Electromigration Damage by Multiple Electrical Measurements", Microelectron. Reliab. 33 1829-40 (1993).
2. B.K. Jones and Y.Z. Xu "The Measurement of the Electrical Properties of -Electromigration Specimens" to be published, Rev. Sci. Inst.
3. B.K. Jones, Y.Z. Xu and P G A Emonts, "Characterisation of Electromigration Damage by Multiple Electrical Measurements", Proc. 3rd European Symposium on Reliability of Electron Devices, Failure Physics and Analysis (ESREF'92) Oct 1992, pps. 363-6.
4. B.K. Jones, W.C. Shih, A.L. Greer and Y.Z. Xu, "Microstructure, damage and resistance during life-testing of Al-Cu interconnects", Materials Research Society Symposium Proceedings 309 pps. 369-376 (1993).
5. S Shingubara, H. Kaneko and M. Saitoh, "Electromigration-induced abrupt changes in electrical resistance associated with void dynamics in aluminium interconnections", J. Appl. Phys. 69 207-12 (1991).
6. B.K. Jones, "Microscopic Measurements of Electromigration Damage Using Electrical Measurements", M.R.S. Symposium San Francisco 1995.
7. S. Shingubara, K. Fujiki, A. Sano, K. Inoue, H. Sakaue, M. Saitoh and Y. Horiike, "Resistance Oscillations Induced by Direct current electro-migration", Jpn. J. Appl. Phys. 34 1030-6 (1995).
8. B.K. Jones, Y.Z. Xu and P. Zobbi, "The evolution of the Microscopic Damage in Electromigration Studied by Multiple Electrical Measurements", Proc. 5th European Symposium on Reliability of Electron Devices, Failure Physics and Analysis (ESREF'94) Glasgow, October 1994, pps. 371-6.