Time-domain characterization and circuit modeling of a multilayer ceramic package

IEEE Transactions on Components Packaging and Manufacturing Technology Part B

Volumn 19, Issue 1, 1996, Pages 48-55

  Jong, Jyh Ming ^a,b   Janko, Bozidar ^c   Tripathi, Vijai K ^a,d  

^a IEEE

^b AGERE SYSTEMS   (United States)

^c TEKTRONIX INC   (United States)

^d Oregon State University   (United States)

Author keywords

Circuit modeling; Crosstalk; Electrical characterization of electronic packages; Multilayer ceramic package; Multiport time domain measurement; Switching noise

Indexed keywords

ALGORITHMS; CERAMIC MATERIALS; CROSSTALK; ELECTRIC VARIABLES MEASUREMENT; EQUIPMENT TESTING; EQUIVALENT CIRCUITS; MATHEMATICAL MODELS; MULTILAYERS; SPURIOUS SIGNAL NOISE; TIME DOMAIN ANALYSIS;

CIRCUIT MODELING; DEVICE UNDER TEST; MULTIDIMENSIONAL PEELING ALGORITHMS; MULTILAYER CERAMIC PACKAGES; MULTIPORT TIME DOMAIN MEASUREMENT; SWITCHING NOISE; TIME DOMAIN REFLECTION;

ELECTRONICS PACKAGING;

EID: 0030085334     PISSN: 10709894     EISSN: None     Source Type: Journal    
DOI: 10.1109/96.486484     Document Type: Article

References (15)

1. D. E. Carlton, K. R. Gleason, R. Hopkins, K. Jones, K. Noonan, and E. W. Strid, "Accurate measurement of high-speed package and interconnect parasitics," in IEEE Custom IC Conf., 1988, pp. 23.3.1-23.3.7,
2. J. C. Toscano, A. E-Riad, S. M. Riad, and A. Y. Al-Mazroo, "Wide-band characterization of multilayer thick film structures using time-domain technique," IEEE Trans. Instrum. Meas., vol. 38, pp. 515-520, Apr. 1989.
3. I. A. Bhutta, A. E-Riad, S. M. Riad, I. Bhal, and K. Ely, "Electrical measurement, modeling, and simulation of electronic packages," Int. J. Microelectron. Electron. Packag., pp. 161-166, Mar. 1994.
4. A. Riad, A. E-Riad, I. Bhutta, and M. B. Hayes, "Time-domain techniques applied to measurement and modeling of microwave packages," in ISHM Int. Symp. Microelectronics, Boston, MA, Nov. 1994, pp. 330-333.
5. A. Riad, A. E-Riad, W. Su, M. B. Hayes, and I. Bhutta, "Wideband electrical characterization of LTCC system," in ISHM Int. Symp. Microelectronics, Boston, MA, Nov. 1994, pp. 312-317.
6. A. Fraser and T. Strouth, "High-speed digital IC package characterization, using microwave probing and fixturing technique," Cascade Microtech, OR, Technical rep. HPPKG-391, 1992.
7. J. M. Jong and V. K. Tripathi, "Time-domain characterization of interconnect discontinuities in high speed circuits," IEEE Trans. Comp., Hybrids, Manufact. Technol., vol. 15, pp. 497-504, Aug. 1992.
8. L. A. Hayden and V. K. Tripathi, "Measurement and characterization of high speed interconnections using time-domain network analysis," in ISHM Proc. Intl. Symp. Microelectronics, San Francisco, CA, 1992, pp. 144-149.
9. J. M. Jong, B. Janko, and V. K. Tripathi, "Equivalent circuit modeling of interconnects from time-domain measurements," IEEE Trans. Comp., Hybrids, Manufact. Technol., vol. 16, pp. 119-126, Feb. 1993.
10. J. M. Jong, L. A. Hayden, and V. K. Tripathi, "Time-domain characterization of coupled interconnects with discontinuities," in IEEE Int. Microwaves Symp., San Diego CA, 1994.
11. L. A. Hayden and V. K. Tripathi, "Calibration methods for time-domain network analysis," IEEE Trans. Microwave Theory Tech., vol. 141, pp. 415-420, Mar. 1993.
12. K. D. Marx and R. I. Eastin, "A configuration-oriented SPICE model for multiconductor lines with homogeneous dielectrics," IEEE Trans. Microwave Theory Tech., vol. 38, pp. 1123-1129, Aug. 1990.
13. J. M. Jong, B. Janko, and V. K. Tripathi, "A model for semi-infinite parallel conducting planes," in Proc. 2nd IEEE EPEP, Monterey, CA, 1993, pp. 225-227.
14. J. M. Jong, "Electrical characterization and circuit modeling of interconnects and packages for high speed circuits by time-domain measurements," Ph.D. dissertation, Department of Electrical and Computer Engineering, Oregon State University, Feb. 1995.
15. J. M. Jong and V. K. Tripathi, "Modeling and simulation of switching noise including power/ground plane resonance for high speed GaAs FET logic (FL) circuits," in IEEE MTT-S Intl. Microwave Symp. Digest, Orlando, FL, May 1995, pp. 1081-1084.