Monitoring plasma over-etching of wafer-bonded microstructures

International Conference on Solid-State Sensors and Actuators, and Eurosensors IX, Proceedings

Volumn 1, Issue , 1995, Pages 269-272

  Gupta, Raj K ^a   Hsu, Charles H ^a   Schmidt, M A ^a   Senturia, S D ^a  

^a MASSACHUSETTS INSTITUTE OF TECHNOLOGY   (United States)

Author keywords

[No Author keywords available]

Indexed keywords

BONDING; COMPUTER SIMULATION; ELASTIC MODULI; ELECTROSTATIC DEVICES; ETCHING; GEOMETRY; MICROELECTRONIC PROCESSING; PERMITTIVITY; SEMICONDUCTOR DEVICE STRUCTURES; SILICON WAFERS; VOLTAGE MEASUREMENT;

ELECTROSTATIC PULL-IN TEST STRUCTURES; PLASMA OVER ETCHING; PROCESS INTEGRITY; PROCESS UNIFORMITY; WAFER BONDED MICROSTRUCTURES; WAFER LEVEL PROBING;

MICROELECTROMECHANICAL DEVICES;

EID: 0029489894     PISSN: None     EISSN: None     Source Type: Conference Proceeding    
DOI: None     Document Type: Conference Paper

References (8)