Chemical-mechanical polishing and material characteristics of plasma-enhanced chemically vapor deposited fluorinated oxide thin films

Journal of the Electrochemical Society

Volumn 144, Issue 3, 1997, Pages 1100-1106

  Tseng, Wei Tsu ^a   Hsieh, Yuan Tsu ^a,b   Lin, Chi Fa ^a,b   Tsai, Ming Shih ^a   Feng, Ming Shiann ^a  

^a NATIONAL CHIAO TUNG UNIVERSITY   (Taiwan)

^b WINBOND ELECTRONICS CORPORATION   (Taiwan)

Author keywords

[No Author keywords available]

Indexed keywords

CHEMICAL BONDS; CHEMICAL POLISHING; COMPOSITION EFFECTS; ELASTIC MODULI; HARDNESS TESTING; MOISTURE; REFRACTIVE INDEX; SILICA; THIN FILMS;

CHEMICAL MECHANICAL POLISHING (CMP); FLUORINATED SILICON DIOXIDE;

FLUORINE COMPOUNDS;

EID: 0031100739     PISSN: 00134651     EISSN: None     Source Type: Journal    
DOI: 10.1149/1.1837539     Document Type: Article

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