Smart-cut®: the basic fabrication process for unibond®soi wafers

IEICE Transactions on Electronics

Volumn E80-C, Issue 3, 1997, Pages 358-363

  Auberton Herve, A J ^a  

^a PARC TECHNOLOGIQUE DES FONTAINES   (France)

Author keywords

Smart cut; SOI; UN1BOND; Wafer bonding

Indexed keywords

CRYSTALLINE MATERIALS; HYDROGEN; ION IMPLANTATION; OXIDES; SEMICONDUCTOR DEVICE MANUFACTURE; SILICON WAFERS; SURFACE ROUGHNESS; THIN FILMS;

HYDROGEN IMPLANTATION; WAFER BONDING TECHNOLOGY;

SILICON ON INSULATOR TECHNOLOGY;

EID: 0031098541     PISSN: 09168524     EISSN: None     Source Type: Journal    
DOI: None     Document Type: Article

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